01, SMT parts solder joints empty welding 02, SMT parts solder joints cold welding: use a toothpick to lightly touch the part pin, if it can be toggled, it is cold welding 03, SMT parts (solder joints) short circuit (tin bridge) 04, SMT parts Missing parts 05, SMT parts wrong parts 06, SMT parts polarity reversal or wrong to cause burning or explosion 07, SMT parts multiple parts 08, SMT parts overturning: text face down 09, SMT parts standing sideways: chip element length ≤ 3mm, width ≤1.5mm not more than five (MI) 10, SMT parts tombstone: chip components end up 11, SMT parts foot offset: side offset is less than or equal to 1/2 of the weldable end width 12, SMT parts floating height: the distance between the bottom of the component and the substrate is 13, the SMT parts foot is high and the height is higher than the thickness of the part foot14, the heel of the SMT part is not flat and the heel is not tinned15, the SMT part cannot be identified (the printing is blurred) 16 , SMT parts foot or body oxidation 17, SMT parts body damage: capacitor damage (MA); resistance damage is less than 1/4 of the component width or thickness (MI); IC damage in any direction length 18, SMT parts use non-specified supply Supplier: According to BOM, ECN 19, SMT parts solder tip: the height of the solder tip is greater than the height of the part body by 20, and the SMT part eats too little tin: the minimum solder joint height is less than the solder thickness plus 25% of the solderable end height or the solder thickness plus 0.5mm, the smaller of which is (MA) 21. SMT parts eat too much tin: the maximum solder joint height exceeds the pad or climbs to the top of the solderable end of the metal plating end cap is acceptable, and the solder contacts the component body (MA) 22. Solder ball/dross: more than 5 solder balls per 600mm2 or solder splash (0.13mm or smaller) is (MA) 23, solder joints with pinholes/blow holes: one solder joint has one (inclusive) The above is (MI) 24. Crystallization phenomenon: white residues on the surface of the PCB board, solder terminals or around the terminals, white crystals on the metal surface 25, unclean board surface: uncleanness that cannot be found within 30 seconds of a long arm distance is allowed Receipt 26. Poor dispensing: the adhesive is located in the area to be soldered, reducing the width of the soldered end by more than 50%. 27. PCB copper foil is warped 28. PCB exposed copper: The exposed copper width of the circuit (gold finger) is greater than 0.5mm as (MA) 29. PCB scratches: the substrate is not seen from scratches 30, PCB burnt yellow: PCB is burnt and yellowed after reflow oven or repaired when the color of the PCB is different 31, PCB bending: bending in any direction is between 300mm Deformation exceeding 1mm (300:1) is (MA) 32, PCB inner layer separation (bubble): the area where blistering and delamination does not exceed 25% (MI) of the distance between plating holes or internal wires; Foaming between vias or internal wires (MA) 33, PCB with foreign matter: conductive (MA); non-conductive (MI) 34, PCB version error: according to BOM, ECN 35, Gold finger dip tin: the position of the tin dip is within 80% of the edge of the board (MA)